发明名称 Metal oxide pattern forming method
摘要 In a pattern forming method for selectively forming an oxide layer on a substrate surface, the substrate surface is selectively coated with a coating layer. On the coating layer and an exposed part of the substrate surface, an oxide layer is formed by the use of a predetermined solution. Subsequently, the oxide layer on the coating layer is removed together with the coating layer to selectively leave the oxide layer on the substrate surface. Thus, a pattern is formed. The coating layer is removed in a liquid phase or optically together with the oxide layer on the coating layer. The oxide layer is formed by the use of, as the predetermined solution, an aqueous solution or a hydrofluoric acid solution of a fluoro metal complex compound and/or metal fluoride of at least one element selected from the group consisting of alkaline earth metal, transition metal, gallium, indium, silicon, tin, lead, antimony, and bismuth in the presence of an fluoride ion capturing agent.
申请公布号 US6679996(B1) 申请公布日期 2004.01.20
申请号 US20000680257 申请日期 2000.10.05
申请人 HOYA CORPORATION;TAKESHI YAO 发明人 YAO TAKESHI
分类号 H01L21/316;B44C1/22;C23C18/12;C23C26/00;H01L39/24;H05K3/06;(IPC1-7):B44C1/22 主分类号 H01L21/316
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