METHOD FOR DICING CHIPS FOR MEMS

摘要

PURPOSE: A method for dicing chips having a MEMS is provided to improve a yield rate and productivity by preventing micro structures from being broken during a dicing process. CONSTITUTION: A grid line and a shape of a wafer, which are identical to the size of a chip to be subject to a dicing process, are drawn on a non-adhesive side of a transparent tape. Then, a micro structure protecting layer is attached to an adhesive side of the transparent tape. After that, the transparent tape is attached to a wafer by matching the grid line with a dicing line of the wafer. Then, the transparent tape is cut into a predetermined size, which is larger than a size of the wafer, and the wafer is mounted on a guide ring so as to perform a dicing process. After that, the transparent tape is removed from the wafer.