METHOD FOR FABRICATING Au-Sn ALLOY SOLDER LAYER AND Au-Sn ALLOY SOLDER BUMP
摘要
PURPOSE: A method for fabricating an Au-Sn solder layer and an Au-Sn solder bump is provided to simplify a fabrication process and reduce a manufacturing cost by depositing an Au layer and an Sn layer and performing a heat treatment process. CONSTITUTION: An Au/Sn laminating structure(70) is formed by depositing Au and Sn on a metallic substance. The Au/Sn laminating structure(70) is heated under the temperature of 280 degrees centigrade. The alloy of Sn and Au is formed by using the liquefied Sn and a solid state of Au. An Au/Sn/Au laminating structure is formed by depositing Au and Sn on the metal substance and depositing Au thereon. The Au/Sn/Au laminating structure is heated under the temperature of 280 degrees centigrade. The alloy of Sn and Au is formed by using the liquefied Sn and the solid state of Au.
申请公布号
KR20040005238(A)
申请公布日期
2004.01.16
申请号
KR20020039726
申请日期
2002.07.09
申请人
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE