发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE, AND SEMICONDUCTOR MEMORY DEVICE
摘要 PURPOSE: To provide a manufacturing method of a semiconductor device for reducing the number of manufacturing processes and difficulty in working by suppressing the missing of a plug or cylinder falling. CONSTITUTION: The manufacturing method of the semiconductor memory device includes a step for forming an electrode film of a cylinder type capacitor from platinum group electrode materials; a step for silicifying a part of the electrode film; a step for selectively removing the silicified portion to separate capacitor cells and forming a lower electrode of the cylinder type capacitor; a step for forming a dielectric film on the lower electrode; and a step for forming an upper electrode on the dielectric film.
申请公布号 KR20040005564(A) 申请公布日期 2004.01.16
申请号 KR20030005035 申请日期 2003.01.25
申请人 FUJITSU LIMITED 发明人 NISHIKAWA NOBUYUKI
分类号 H01L21/8242;H01L21/02;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L21/824 主分类号 H01L21/8242
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