发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE, AND SEMICONDUCTOR MEMORY DEVICE |
摘要 |
PURPOSE: To provide a manufacturing method of a semiconductor device for reducing the number of manufacturing processes and difficulty in working by suppressing the missing of a plug or cylinder falling. CONSTITUTION: The manufacturing method of the semiconductor memory device includes a step for forming an electrode film of a cylinder type capacitor from platinum group electrode materials; a step for silicifying a part of the electrode film; a step for selectively removing the silicified portion to separate capacitor cells and forming a lower electrode of the cylinder type capacitor; a step for forming a dielectric film on the lower electrode; and a step for forming an upper electrode on the dielectric film.
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申请公布号 |
KR20040005564(A) |
申请公布日期 |
2004.01.16 |
申请号 |
KR20030005035 |
申请日期 |
2003.01.25 |
申请人 |
FUJITSU LIMITED |
发明人 |
NISHIKAWA NOBUYUKI |
分类号 |
H01L21/8242;H01L21/02;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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