| 摘要 |
PURPOSE: A method and an apparatus are provided to achieve improved efficiency of evacuation of impurity gas by removing impurity gases through sputtering and temperature rising processes. CONSTITUTION: A method comprises a front substrate forming step of forming a scan electrode, a dielectric layer and an MgO protective layer on a glass plate(100); a rear substrate forming step of forming an address electrode, a barrier rib and a phosphor layer on the glass substrate; a phosphor layer firing step of firing the phosphor layer at the temperature of 500°C; an evacuation step of removing impurity gases from the substrate by performing an ion sputtering process to the substrate; a sealing step of sealing the front substrate and the rear substrate; and an injection step of injecting discharge gases into the substrate where impurity gases are removed. |
