发明名称 |
Particle-filled semiconductor attachment material |
摘要 |
Disclosed is a high thermal conductance attachment mixture for semiconductor package assembly which includes high thermal conductance particles suspended in reflowable material. The high thermal conductance particles have a high melting point relative to the reflowable material and comprise approximately 50% to approximately 95% by volume of the high thermal conductance attachment mixture. Also disclosed is a semiconductor package including the high thermal conductance attachment mixture. An associated method of attaching adjoining layers of a semiconductor die package using a high thermal conductance attachment mixture is also disclosed.
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申请公布号 |
US2004007780(A1) |
申请公布日期 |
2004.01.15 |
申请号 |
US20020192004 |
申请日期 |
2002.07.09 |
申请人 |
HUNDT PAUL JOSEPH;STIBOREK LEON |
发明人 |
HUNDT PAUL JOSEPH;STIBOREK LEON |
分类号 |
H01L21/56;H01L23/373;H01L23/42;(IPC1-7):H01L21/44;H01L23/58;H01L29/40 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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