| 摘要 |
PROBLEM TO BE SOLVED: To provide a wavefront aberration measurement device, an aligner, and a semiconductor device manufacturing system and a method, which are capable of realizing a very accurate exposure by taking a very small change over aging in wavefront aberration into consideration so as to manufacture an ultraminiaturized semiconductor device with high yield, even when margins become narrow with ultraminiaturization of the semiconductor device. SOLUTION: In an aligner, a pattern generates light that spreads evenly on the pupil of a projection optical system on a reticle stage, a relay lens is provided to serve as a conjugate point of the pupil plane of the optical system, a main plane is arranged at the conjugate point of the pupil plane of the optical system formed of the relay lens, and the wavefront aberration measurement device is provided. The wavefront measurement device is equipped with a lens array forming a large number of the secondary images of the pattern by dividing the wavefront of light coming from the primary image of the pattern formed on the image plane of the optical system, an imaging device which images a large number of the secondary images of the pattern formed by the lens array and outputs a large number of pattern signals, and a processing means which calculates the sagittal of the projection optical system on the basis of a large number of the pattern signals obtained from the imaging device. COPYRIGHT: (C)2004,JPO
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