| 摘要 |
PROBLEM TO BE SOLVED: To provide a land of a circuit board and its formation method which enable a chip component or the like to be mounted surely on the circuit board. SOLUTION: A land 2 for mounting a chip component 4 or the like is provided on an insulation base material, a slit 1 is formed along an outside dimension of the chip component 4, and copper foils 5 in a plurality of places for formation of a solder fillet are formed between the slits 1. Since the slit 1 is formed in the land 2, it is possible to prevent shift when the chip component 4 or the like is mounted without being affected by surface tension in solder melting. Furthermore, since the solder fillet forming copper foil part 5 is provided, it is possible to prevent displacement of the chip component 4 or the like and to ensure a solder fillet region. COPYRIGHT: (C)2004,JPO
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