发明名称 DEVICE AND METHOD FOR CONTROLLING FILM DEPOSITION
摘要 PROBLEM TO BE SOLVED: To stably control the film deposition rate to a substrate W1 when a film deposition material is scattered inside a vacuum tank 1 by a film deposition source 5 to deposit a film on the substrate W1, and the film thickness of the film deposition material to be deposited on the substrate W1 is measured with an optical film thickness gauge 8, and to improve film deposition performance at a low cost. SOLUTION: A standard value Vs corresponding to a prescribed film deposition rate is previously set per reflectivity or transmissivity measured with the optical film thickness gauge 8. The film deposition conditions in the film deposition source 5 are controlled so that, in comparison between an actual measured value Vr measured with the optical film thickness gauge 8 and the standard value Vs, the measured value Vr coincides with the standard value Vs. The film deposition rate can stably be controlled while a dedicated film thickness gauge for monitoring the film deposition rate is made needless. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004011012(A) 申请公布日期 2004.01.15
申请号 JP20020169686 申请日期 2002.06.11
申请人 SHIN MEIWA IND CO LTD 发明人 TANAKA MASAFUMI
分类号 G01B11/06;C23C14/54;(IPC1-7):C23C14/54 主分类号 G01B11/06
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