发明名称 SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a magnetron sputtering apparatus provided with a function of controlling particles which exfoliate from a deposition shield. SOLUTION: The sputtering apparatus has the deposition shield 6 of which the internal parts close to a stage 3 are formed so as to tilt toward the inside of a chamber 1. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004010940(A) 申请公布日期 2004.01.15
申请号 JP20020164158 申请日期 2002.06.05
申请人 TOSHIBA CORP 发明人 NONAKA TAKAHIRO
分类号 C23C14/00;H01L21/285;(IPC1-7):C23C14/00 主分类号 C23C14/00
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