Method for detecting wafer level defect

摘要

A method for detecting wafer level defect by die-to-aerial image comparison is disclosed. The method utilizes patterns in a database which are used to form photo masks utilized in photolithography processes to simulate aerial images. The simulation aerial images are then compared with die images produced by the photo masks to find out wafer level defects without missing any repeating defect induced by the photo masks and mistaking any process deviation as a wafer level defect.