INTEGRATED CIRCUIT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To increase the degree of vertical separation between a passing wordline and a strap.

SOLUTION: If the thickness of an insulation layer is decreased in an SOI integrated circuit including a trench capacitor DRAM array, crosstalk is caused between a trench capacitor and the passing wordline 214 which passes over the trench capacitor. The buried strap on a capacitor center electrode 105 is enabled to come into contact with the backside of an SOI layer 60 by increasing the depth of a recess at the upper part of the trench and laterally undercutting the insulating layer, thereby increasing the degree of vertical separation between the passing wordline 214 and the strap.

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