| 摘要 |
<P>PROBLEM TO BE SOLVED: To stabilize a ground/power source potential without decreasing the number of pins for a signal. <P>SOLUTION: A semiconductor device comprises a plurality of leads 1a, a tab smaller than a semiconductor chip 2, a suspension lead 1e which is connected to the tab and has an exposure part of the suspension lead, four bar leads 1f which are connected to the suspension lead 1e and are disposed outside the semiconductor chip 2, a first wire 4a for connecting a pad 2a of the semiconductor chip 2 with the lead 1a, a second wire 4b for connecting the pad 2a of the semiconductor chip 2 with the bar lead 1f, and a sealant for sealing the semiconductor chip 2 with a resin. A space between the exposure part of the suspension lead and the exposure part of the lead on the back of the sealant is equal to or more than a space between the exposure parts of leads, whereby the suspension lead 1e can be used as an external terminal and it can be intended to stabilize a potential of a ground or a power source. <P>COPYRIGHT: (C)2004,JPO |
