| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film forming system and a film forming method by which the controllability of the thickness of the film of a film forming material is improved while suppressing the quantity of the film forming material to be used. <P>SOLUTION: The film forming system is provided with a wafer holding means for holding a wafer W, a tilting means for tilting the wafer holding means, a tilt angle control means for controlling the tilt angle of the wafer holding means, a rotation means for rotating the wafer holding means as the wafer holding means is tilted and a means for controlling the number of revolution of the wafer holding means. <P>COPYRIGHT: (C)2004,JPO |
