| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the reliability of a multi chip module with respect to a change in temperature. <P>SOLUTION: For example, two integrated circuit chips 24 and 24 are arranged on a substrate 21, with each top face being located in the same plane. Between the integrated circuit chips 24 and 24, a spacer 25 having a coefficient of thermal expansion the same as those of the integrated circuit chips 24 and 24 is located. An interconnection line 26 is formed on the spacer 25 by lithography technology. <P>COPYRIGHT: (C)2004,JPO</p> |
