| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device in which both insulating characteristics and heat dissipating characteristics are maintained without upsizing the package, and to provide a method for manufacturing it. SOLUTION: An insulating resin film 4 is formed on a first surface of a metal foil. The metal foil is selectively removed to form a specified circuit pattern 6. An electronic component is fixed and connected onto the circuit pattern. At least the surface where the circuit pattern of the insulating resin film is not formed is exposed, and the electronic component is resin-sealed. COPYRIGHT: (C)2004,JPO |
