| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing method which is free from causing excessive deformation in a diaphragm. SOLUTION: In a substrate processing device for holding a periphery of a substrate W by means of a plurality of holding members provided to a rotor and for processing the substrate W by rotating it by the rotor, a pressure-applying device 130 for applying a pressure to the periphery of the substrate W is provided to any of the holding members. The pressure-applying device 130 has a contact 160 in contact with the periphery of the substrate W, a cylinder mechanism 161 which moves the contact 160 between a position in contact with the periphery of the substrate W, and a position separated from the periphery of the substrate W, and a deformation part 162 which is elastically deformed as the contact 160 moves and keeps the cylinder mechanism 161 away from the atmosphere around the substrate W. COPYRIGHT: (C)2004,JPO
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