METHOD OF MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURED BY IT

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board that can maintain an excellent etching factor in a formed circuit and can effectively prevent occurrence of surface-layer migration by eliminating etching residues. SOLUTION: In the method of manufacturing the printed wiring board using a copper-plated laminated board in which a conductive circuit forming layer formed by laminating a copper layer and a metallic layer of a metal other than copper upon another and an insulating substrate are stuck to each other so that the copper layer of the circuit forming layer is exposed on the surface, the etching of the conductive circuit forming layer is performed through a first etching step of simultaneously dissolving the copper layer and metallic layer forming the circuit forming layer and a second etching step performed after the first etching step by using a selective etchant for dissolving the metal constituting the metallic layer without dissolving the copper. COPYRIGHT: (C)2004,JPO