发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module which is equipped with a thermoelement that is provided with electrode joint end surfaces having low electric resistance and high current efficiency. SOLUTION: The thermoelectric module 1 is composed of the thermoelement 3 sandwiched between an upper board 6a and a lower board 6b. The thermoelement 3 is joined to an upper electrode 2a formed on the lower surface of the upper board 6a and a lower electrode 2b formed on the top surface of the lower board 6b with solder 4a and 4b. Ni plating films 5a and 5b are formed on the joint end surfaces of the termoelement 3 respectively through an electroless plating method. The plating films 5a and 5b each have resistivity of 10 to 60μΩ.cm. By this setup, heat generated by the resistance of the Ni electroless plating films 5a and 5b can be reduced, and the thermoelectric module 1 can be improved in thermoelectric properties. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004014766(A) 申请公布日期 2004.01.15
申请号 JP20020165497 申请日期 2002.06.06
申请人 YAMAHA CORP 发明人 NAKAMURA YASUTAKA;YASUTAKE HIDETOSHI
分类号 H01L23/38;H01L35/08;H02N11/00;(IPC1-7):H01L35/08 主分类号 H01L23/38
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