| 摘要 |
PROBLEM TO BE SOLVED: To provide a mother board for manufacturing a circuit board structured to easily and accurately detect whether or not a conductive layer provided in a cable part for connecting a component packaging part on the circuit board is mounted at a proper position, and to provide a manufacturing method of the circuit board. SOLUTION: In the mother board for punching and manufacturing the circuit boards, constituted by connecting a plurality of component packaging parts 1a and 1b with a cable part 2 and provided with a conductive layer 5 for shielding electromagnetic waves in the cable part, a plurality of circuit patterns 3a-3h formed to have a prescribed distance to the cable part are provided in a sacrificial board portion very close to the cable part on the mother board. COPYRIGHT: (C)2004,JPO
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