| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of radiating the heat generated by electronic components. SOLUTION: Holes 2 are pierced in a board body 1, a copper plating film 3 about 10μm thick is formed on the inner surfaces of the holes 2 and the surface of the board body 1 and silver paste obtained by mixing and dispersing silver grains on which radial projections are formed into a binder consisting of epoxy thermosetting resin is charged into the holes 2 and cured to form heat conductive components 4. Then a copper plating film 8 about 15μm thick is formed on the surfaces of the copper plating film 3 and the heat conductive components 4. A component contact layer 5 consisting of the copper plating films 3, 8 is formed on one surface of the board body 1, and a heat radiation layer 6 consisting of the copper plating films 3, 8 is formed on the other surface of the board body 1. COPYRIGHT: (C)2004,JPO
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