发明名称 ATMOSPHERIC PRESSURE PLASMA PROCESSING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an atmospheric pressure plasma processing system capable of processing an object efficiently and continuously by forming a planar plasma. SOLUTION: An atmospheric pressure plasma head is disposed in an atmospheric pressure chamber oppositely to a substrate being processed, a stabilized atmospheric pressure plasma is generated by supplying discharge gas and processing gas into the atmospheric pressure chamber, and the substrate is subjected to plasma processing. In such an atmospheric pressure plasma processing system, the exciting frequency of power being applied to the atmospheric pressure plasma head is set in the range of 100 kHz-2.45 GHz, and the atmospheric pressure plasma head is arranged to form a planar plasma. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004014630(A) 申请公布日期 2004.01.15
申请号 JP20020163215 申请日期 2002.06.04
申请人 ULVAC JAPAN LTD 发明人 TAKEI HIDEO;SAKIO SUSUMU;ISHIBASHI AKIRA;ISHIKAWA MICHIO
分类号 C23C16/509;H01L21/205;H01L21/3065;(IPC1-7):H01L21/306 主分类号 C23C16/509
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