发明名称 Printed circuit board assembly
摘要 A printed circuit board assembly is disclosed. The printed circuit board assembly includes a first circuit board, a second circuit and a third circuit board. The first circuit board includes a first surface and a second surface opposite each other. The second circuit board is disposed on the first surface of the first circuit board and electrically connected thereto. The third circuit board is disposed on the second surface of the first circuit board and electrically connected thereto. The second and the third boards are both smaller than the first board. Electronic components with large thickness are mounted on the exposed first and second surfaces of the first circuit board. Electronic components with smaller thickness are mounted on the second or third circuit board.
申请公布号 US2004008495(A1) 申请公布日期 2004.01.15
申请号 US20030600599 申请日期 2003.06.23
申请人 HO CHIN-WEI 发明人 HO CHIN-WEI
分类号 H05K1/00;H05K1/14;H05K1/18;H05K3/30;(IPC1-7):H05K1/00 主分类号 H05K1/00
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