发明名称 |
Semiconductor device with terminals, and method of manufacturing the same |
摘要 |
A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby forming resin-sealed sections. A plurality of solder balls are formed on the back surface of the substrate such that an interval A between the closest solder balls of adjacent semiconductor chips becomes "n" times ("n" is an integer greater than 1) an interval B between the solder balls on the semiconductor chip. After the semiconductor chips have been subjected to an electrical test, the resin-sealed sections and the substrate are sliced, thus breaking the semiconductor chips into pieces. |
申请公布号 |
US2004007783(A1) |
申请公布日期 |
2004.01.15 |
申请号 |
US20030336801 |
申请日期 |
2003.01.06 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MICHII KAZUNARI;SHINONAGA NAOYUKI;SEMBA SHINJI |
分类号 |
H01L23/12;H01L21/56;H01L21/60;H01L23/48;H01L23/498;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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