| 摘要 |
A method for patterning a device layer, for example of an organic electronic or optoelectronic device, using a patterned stamp. The method comprising the steps of: (1) providing a substrate; (2) bringing the patterned stamp into contact with the substrate; (3) removing the patterned stamp from the substrate; characterised in that step (2) is carried out so that the surface energy of the substrate is modified in accordance with the pattern; and that the method further comprises a step (4) depositing a solution of a device layer on the substrate after the patterned stamp has been removed; whereby the surface energy of the substrate determines the deposition pattern of the device layer. |
