| 摘要 |
PROBLEM TO BE SOLVED: To enhance the planar accuracy of a ground planar article, e.g. a semiconductor wafer, when it is planarized by grinding. SOLUTION: The chuck table 10 for suction holding the planar article comprises a porous plate 12 formed of a porous material and having a holding surface 12a for suction holding the planar article, and a base 11 for supporting the porous plate 12 and having a suction region 15 for transmitting a suction force to the porous plate 12. A part for sealing the region of the holding surface 12a mounting the planar article and the region other than the back surface is formed on the porous plate 12. The suction region 15 is formed to suck the back surface of the region on the porous plate 12 not mounting the planar article. COPYRIGHT: (C)2004,JPO |
