发明名称 ELECTROSTATIC CHUCK AND PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electrostatic chuck and a processing apparatus which can prevent defective release when a sample is released and can shorten the time required for such release of sample. SOLUTION: In the electrostatic chuck 4 consisting of a chuck electrode 41 and an insulation layer 42 provided on the surface of the relevant chuck electrode, a conductive layer 43 is formed on the entire part of the placing surface of insulation layer 42 to attract the sample. Since the area where the conductive layer 43 is formed is wider than the sample, the circumferential edge of the sample is exposed in the upper side when the sample is placed. Moreover, the conductive layer 43 is made of a high resistance body such as polysilicon. When the sample is released, the electrostatic chuck 4 is first connected to the earth to generate a cleaning (discharging) plasma on the upper side of the sample. Accordingly, the charges in the area near the attraction surface are released to the plasma side from the circumferential edge of the conductive layer 43 for cleaning. Thereafter, the sample can be released from the placing surface with lift pins 51. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004014868(A) 申请公布日期 2004.01.15
申请号 JP20020167564 申请日期 2002.06.07
申请人 TOKYO ELECTRON LTD 发明人 SHIBUYA MUNEHIRO;YAKUSHIJI HIDEAKI;RAZAK BINMOHAMMAD ARIRI
分类号 C23C16/458;H01L21/68;H01L21/683;H02N13/00;(IPC1-7):H01L21/68 主分类号 C23C16/458
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