| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein frequency characteristics can be improved even for a package structure using a bonding wire. SOLUTION: A wiring pattern 11 is formed on the surface of a wiring board 10 together with the formation of a group of bonding pads 14, and a via connection portion 15 is formed between the pads and the back of the wiring board 10. Further, an IC chip 20 is bonded and fixed to the surface side in the face-up state thereof using a bonding agent 17, and a group of external electrodes 32 are arranged in the form of a matrix on the back of the wiring board. The group of the bonding pads and a group of pads 21 formed on the upper surface of the chip are interconnected with a bonding wire 30, and are sealed with a resin package 31 to cover the chip including the bonding wire and the wiring board. At least one bonding pad 14a contained in a path for a high frequency signal among the group of the bonding pads is disposed further closely to the IC chip than the other bonding pads. COPYRIGHT: (C)2004,JPO
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