发明名称 THERMOELECTRIC MATERIAL AND THERMOELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric material in which a dimensionless performance index of a thermoelectric device has a small reduction due to a temperatures rise, and which enhances a thermoelectric characteristic. SOLUTION: When A is Bi and/or Sb, A' is Pb and/or Sn, B is one kind or more of compound semiconductor selected from Te, Se and S, and C is at least one kind of compound semiconductor selected from a group consisting of PbTe, SnTe, Li<SB>2</SB>Te, ZnI<SB>2</SB>, BiI<SB>3</SB>, CdI<SB>2</SB>, BI<SB>2</SB>Te<SB>3</SB>, Bi<SB>2</SB>Se<SB>3</SB>, Sb<SB>2</SB>Te<SB>3</SB>, Sb<SB>2</SB>Se<SB>3</SB>, CeTe<SB>2</SB>, and TiSe<SB>2</SB>, the compound semiconductor of C is annexed to the compound semiconductor represented by A<SB>2</SB>B<SB>3</SB>or A'B in the range which exceeds 0 and is 10 wt.% or less based on A<SB>2</SB>B<SB>3</SB>or A'B. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004014804(A) 申请公布日期 2004.01.15
申请号 JP20020166235 申请日期 2002.06.06
申请人 CENTRAL RES INST OF ELECTRIC POWER IND 发明人 KUSANO DAISUKE;HORI YASUHIKO
分类号 H01L35/16;H01L35/34;H02N11/00;(IPC1-7):H01L35/16 主分类号 H01L35/16
代理机构 代理人
主权项
地址