发明名称 |
CHIP TYPE SURGE ABSORBER AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a chip type surge absorber and its manufacturing method realizing a lower capacity, a lower-voltage discharging and a high surge life. SOLUTION: For the chip type surge absorber comprises discharge electrodes 2, 3 arranged on an insulation board 1 so as to face each other through a discharge gap 4, and a lid 6 with its peripheral edge part adhered on an outer periphery part of the insulation board including a base end part of each discharge electrode, a varistor material B in contact with each discharge electrode is fitted to each discharge gap. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004014437(A) |
申请公布日期 |
2004.01.15 |
申请号 |
JP20020169777 |
申请日期 |
2002.06.11 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
FUJIWARA KAZUTAKA;TANAKA YOSHIYUKI;SHIYATOU YASUHIRO;HARADA KOICHIRO |
分类号 |
H01T1/20;H01T4/10;H01T4/12;H01T21/00;(IPC1-7):H01T1/20 |
主分类号 |
H01T1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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