发明名称 |
Solvent-free thermosetting resin composition, process for producing the same, and product therefrom |
摘要 |
A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.
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申请公布号 |
US2004007769(A1) |
申请公布日期 |
2004.01.15 |
申请号 |
US20030602713 |
申请日期 |
2003.06.25 |
申请人 |
TAKAHASHI AKIO;SATSU YUICHI;NAKAI HARUKAZU;SUZUKI MASAO;ITO YUZO;OOHARA SHUICHI |
发明人 |
TAKAHASHI AKIO;SATSU YUICHI;NAKAI HARUKAZU;SUZUKI MASAO;ITO YUZO;OOHARA SHUICHI |
分类号 |
C08G59/40;C08G77/42;C08L63/00;C09D183/10;H01L21/56;H01L23/29;H01L23/498;(IPC1-7):H01L23/02 |
主分类号 |
C08G59/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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