| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding wire that is excellent in ball forming property and can suppress the damage to an integrated circuit element at bonding. <P>SOLUTION: This bonding wire has a core material and a coating layer formed on the core material. The core material is constituted of a material other than gold having micro-Vickers hardness of ≤80 Hv. The coating layer is constituted of a metal having a melting point higher than that of the core material by ≥300°C and an oxidation resistance higher than that of copper. When the materials of the core material and coating layer are limited in this way, balls, particularly, small-diameter balls having nearly complete roundness can be formed stably and highly reliable bonding can be obtained. <P>COPYRIGHT: (C)2004,JPO |
