发明名称 SUBSTRATE WITH BOTH SIDES CONNECTED TERMINALS AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a substrate with terminals of both sides are connected and a method for manufacturing this. SOLUTION: This discloses a substrate provided with a substrate proper that has a circuit pattern formed on both sides and has at least one connecting hole formed, at least one upper terminal connected with the circuit pattern formed on the top surface of the substrate proper, and a lower terminal connected with the circuit pattern formed on the bottom surface of the substrate proper and arranged in a position corresponding to the upper terminal, and that has the end part of the upper terminal and that of the lower terminal coupled in the connecting hole in an electrically conductive manner so that the terminals on both sides are connected, as well as its manufacturing method. Accordingly, the substrate has a small economical loss, and is excellent in durability of the connected part between the upper terminal and the lower one. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004015064(A) 申请公布日期 2004.01.15
申请号 JP20030163920 申请日期 2003.06.09
申请人 SAMSUNG TECHWIN CO LTD 发明人 RO KYOKO
分类号 H05K1/11;H05K3/32;H05K3/40;(IPC1-7):H05K1/11 主分类号 H05K1/11
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