| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having such a structure that an electrode plate is soldered to the top of a semiconductor element by surface, satisfactory stress relaxation properties at its joint, and a wide space that is suitable for wire bonding secured in the electrode plate. <P>SOLUTION: An electrode plate 170 extending planarly while being divided is connected with the top of a power element 10 by surface by a solder layer 30 provided planarly. The periphery portion of the electrode plate 170 is divided into square-shaped electrode pieces 172, and the inward portion of the electrode plate 170 is divided into the square-shaped electrode pieces 174 that are larger than the electrode pieces 172. Since the periphery portion of the electrode plate 170 is divided into finer electrode pieces 172, the thermal stress or the like exerted on the solder layer 30 can be relaxed efficiently. Since the electrode pieces 174 constituting the inward part of the electrode plate 170 are divided coarsely, the connecting space of a bonding wire 20 can be taken up widely. <P>COPYRIGHT: (C)2004,JPO</p> |
