| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a double-sided wiring tape carrier suitable for the formation of a fine pitch pattern, and to provide a tape carrier manufactured thereby. SOLUTION: A polyimide film 1 which has a copper layer 3 bonded on each surface via a metal layer 2 is prepared. On the front surface of one of the copper layers 3, a pattern 6 for forming vias is formed by photo-etching. With the pattern 6 as a mask, blind vias 8 are formed by polyimide-etching using an alkaline solution. Thereafter, a circuit pattern 9 is formed by photo-etching. After masking portions unnecessary for connecting the copper layers, internal portions of the blind vias 8 are filled by plating 11 by depositing the plating 11 from bottom faces of the vias, to electrically connect the copper layers. COPYRIGHT: (C)2004,JPO
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