RESIDUAL FILM MONITORING DEVICE, POLISHING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a residual film monitoring device capable of properly monitoring the states of polishing residual films in the whole region or a wide region of a surface to be polished of an object to be polished.

SOLUTION: Light emitted from a white light source 404 is reflected by a white diffusion reflector 403 and is scattered to substantially uniformly light substantially the whole region of the surface to be polished of wafer Wm chucked by a chuck. Bright visual field images in the whole regions of the wafer Wm by light irradiated on the wafer Wm and reflected by the wafer Wm are formed on an imaging surface of a color CCD 401 by a photographic lens 402 and is imaged by the CCD 401. A processing part 405 outputs the presence or absence of polishing residual films in the whole region of the surface to be polished of the wafer Wm as a monitoring result based on color image information obtained from the CCD 401.

COPYRIGHT: (C)2004,JPO