| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board for lamination for achieving the construction of a laminated circuit extremely economically and easily without using any spacers that have been indispensably used for a conventional laminated circuit. <P>SOLUTION: The circuit board for lamination is the one where conductive layers 102, 103 for composing a circuit are formed on both the front and rear of an insulated substrate 101. Both the conductive layers on both the front and rear can be electrically joined via a via hole 104 that physically penetrates the insulated substrate. Further, at least one conductive projecting section 105 is provided on at least one conductive layer in both the conductive layers. Additionally, the laminated circuit is the one where at least one circuit board and at least one semiconductor wafer are successively laminated, the circuit board for lamination is used as the circuit board, and each circuit board is electrically joined to the conductive projecting section. <P>COPYRIGHT: (C)2004,JPO |
