发明名称 THERMAL INSULATING DOOR
摘要 PROBLEM TO BE SOLVED: To effectively reinforce a thermal insulating door by a simple structure. SOLUTION: This thermal insulating door D is disposed with a synthetic resin rear plate 20 in the rear side of a metal surface plate 10 and formed by filled with resin foam 40 between them. A thick-wall metal reinforcing board 30 is applied to the rear surface of a circumferential wall 12 comprising the circumferential surface of the door D. The reinforcing board 30 is formed into a groove shape having hooked side boards 32 in the both side edges of a base board 31. The reinforcing board 30 has a plurality of through holes 34 and 35 opened from the base board 31 to the hooked side boards 32. The projecting edges of the both hooked side boards 32 are formed with notches 36. The reinforcing board 30 is difficult to be regularly stuck over the three sides of the circumferential wall 12 of the surface plate 11, the circumferential edge of the surface part 11, and a rear frame 15 and is apt to be formed with a clearance S in a part, however, the injected resin foam 40 fills the clearance S through the through holes 34 and 35. The reinforcing board 30 is firmly fixed by being pushed against the rear surface of the circumferential wall 12 with the clearance S filled with the resin foam 40. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004011935(A) 申请公布日期 2004.01.15
申请号 JP20020161800 申请日期 2002.06.03
申请人 HOSHIZAKI ELECTRIC CO LTD 发明人 ITAKURA AKIRA;ONDA RYOICHI
分类号 F25D23/08;F25D23/02;(IPC1-7):F25D23/08 主分类号 F25D23/08
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