发明名称 |
VERFAHREN UND APPARATE ZUR KLEMMUNG UND ENTKLEMMUNG EINER HALBLEITERSCHEIBE IN EINEM SCHEIBENBEARBEITUNGSSYSTEM |
摘要 |
A method for clamping a wafer to an electrostatic chuck having a substantially resistive dielectric layer disposed thereon. The method includes the step of providing a build-up voltage having a first polarity to a pole of the electrostatic chuck to cause a potential difference to build up between a first region of the substantially resistive dielectric layer and a second region of the wafer that overlies at least a portion of the first region. This potential difference gives rise to a clamping force to clamp the wafer to the electrostatic chuck. The method further includes the step of terminating the build-up voltage when the clamping force substantially reaches a predefined level. There is further included the step of providing a holding voltage to the pole of the electrostatic chuck to substantially maintain the clamping force at the predefined level. This holding voltage has the first polarity and a magnitude that is lower than a magnitude of the build-up voltage. There is further included the step of providing a declamping voltage to the pole of the electrostatic chuck to substantially remove the clamping force, the declamping voltage having a polarity that is opposite to the first polarity. |
申请公布号 |
AT256917(T) |
申请公布日期 |
2004.01.15 |
申请号 |
AT19970932376T |
申请日期 |
1997.06.27 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
KUBLY, MARC, B.;BENJAMIN, NEIL, MARTIN, PAUL;GERMAIN, STEVEN, D. |
分类号 |
B25J15/06;H01L21/68;H01L21/683;H02N13/00;(IPC1-7):H01L21/68 |
主分类号 |
B25J15/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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