| 发明名称 |
PACKAGING DEVICE AND PACKAGING METHOD OF OPTICAL WAVEGUIDE DEVICE MODULE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that deviation of a position occurs when performing the positioning of an SHG second harmonic generation element in manufacturing an optical waveguide device module. <P>SOLUTION: A holding force of a collet 28 for holding the SHG element 9 to the SHG element 9 in a horizontal direction is made to be larger than the stress which the SHG element receives from an adhesive material. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004012992(A) |
申请公布日期 |
2004.01.15 |
| 申请号 |
JP20020168753 |
申请日期 |
2002.06.10 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YOKOYAMA TOSHIFUMI;KITAOKA YASUO;YAMAMOTO KAZUHISA;MORIKAWA AKIHIRO |
| 分类号 |
G02B6/42;G02F1/377;H01L21/50;H01S5/022;(IPC1-7):G02B6/42 |
主分类号 |
G02B6/42 |
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