发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT, ELEMENTS WITH COOLING BODY AND TEMPERATURE SENSOR |
摘要 |
PROBLEM TO BE SOLVED: To detect the temperature accurately and promptly especially when dissipating heat from an integrated circuit in the region of heat sink of a semiconductor circuit element when a sensor of small heat capacity is used. SOLUTION: A semiconductor element with an integrated circuit, a cooling body and a temperature sensor is provided where a temperature sensor has a thin-film shaped measurement resistor, this thin-film shaped measurement resistor is adhered on the surface of a thin-film like substrate which has electrically insulating characteristics, the whole thickness for the temperature sensor is within the range of 10μm to 100μm, and the temperature sensor is thermally connected with a cooling body. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004015061(A) |
申请公布日期 |
2004.01.15 |
申请号 |
JP20030161197 |
申请日期 |
2003.06.05 |
申请人 |
HERAEUS SENSOR TECHNOLOGY GMBH |
发明人 |
WIENAND KARL-HEINZ;ULLRICH KARLHEINZ |
分类号 |
G01K7/18;H01L23/34;(IPC1-7):H01L23/34 |
主分类号 |
G01K7/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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