| 摘要 |
PROBLEM TO BE SOLVED: To provide a stencil printing plate in which resin is prevented from coming around the backside of the stencil printing plate. SOLUTION: A plurality of ribs 5 extend in one direction on the front surface side of the stencil printing plate 1, wherein the stencil printing plate is for stencilling semiconductor chips mounted on a substrate with a sealing resin. COPYRIGHT: (C)2004,JPO
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