| 摘要 |
PROBLEM TO BE SOLVED: To allow a substrate for transfer to be easily pilled off from the side of a disk substrate. SOLUTION: A signal layer 12 is deposited on irregularity information 11c preliminarily formed on one surface of the disk substrate 11, a peeling layer 22 is deposited on irregularity information 21c preliminarily formed on one surface of the substrate 21 having diameter D2 of circumference 21b larger than diameter D1 of circumference 11b of the disk substrate 11, a second light transmission layer 13B by transparent ultraviolet cured resin is deposited on the peeling layer 22 and furthermore, the substrate 21 is peeled from the side of the disk substrate 11 as attaching the peeling layer 22 on the substrate 21 after adhering the second light transmission layer 13B on the side of the substrate 21 via a first light transmission layer 13A by a transparent adhesive agent dropped on the signal layer 12 on the side of the disk substrate 11. COPYRIGHT: (C)2004,JPO
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