| 发明名称 |
PROCESSING DEVICE AND PROCESSING METHOD |
| 摘要 |
<p>A processing device and a processing method for applying a specified processing to a substrate such as a wafer to prevent a hard mask from peeling off during a polishing processing performed later, the processing device comprising a sloped part so that a film thickness can be reduced toward the outer peripheral parts and the end parts of the substrate having a film formed thereon.</p> |
| 申请公布号 |
WO2004006318(A1) |
申请公布日期 |
2004.01.15 |
| 申请号 |
WO2003JP08352 |
申请日期 |
2003.07.01 |
| 申请人 |
TOKYO ELECTRON LIMITED;IWASHITA, MITSUAKI;KONISHI, NOBUO |
发明人 |
IWASHITA, MITSUAKI;KONISHI, NOBUO |
| 分类号 |
H01L21/00;(IPC1-7):H01L21/31;H01L21/302;H01L21/027 |
主分类号 |
H01L21/00 |
| 代理机构 |
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