| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate patching device, substrate patching method and card manufacturing device capable of realizing high-accurate aligning of an antenna substrate to a core material and manufacturing an IC card with excellent appearance quality and reliability. <P>SOLUTION: An opening 57 is provided on a stage 45A, 45B correcting the attitude in the rotation direction of the antenna substrate 12, and the amount of the displacement of the chip mounting portion of the antenna substrate 12 to the center of this opening 57 with an imaging apparatus 95 and a controller 96. The detected amount of the displacement is supplied to an XYZ driving portion 93 as a control signal for compensating the movement amount of the antenna substrate 23 by substrate transfer/a patching portion 81. Thereby the antenna substrate 12 can be high-accurately aligned to an inside core sheet 13 to be stuck. <P>COPYRIGHT: (C)2004,JPO |
