CHIP PACKAGING METHOD, CHIP MOUNTER, AND BOND FOR PACKAGING CHIP

摘要

PROBLEM TO BE SOLVED: To provide a chip packaging method and a mounter for reliably and securely joining the protruding electrode of a chip and the electrode of an object to be packaged.

SOLUTION: In the packaging method of chips, the protruding electrode 2 protruding from the lower surface of the chip 1 is pressed against the electrode 5 of the object 4 to be packaged by bond 10 containing a filler 11, and the chip 1 is subjected to ultrasonic vibration in a horizontal direction for joining the protruding electrode 2 to the electrode. In the packaging method, the filler 11 having a diameter that is smaller than the amplitude of the ultrasonic vibration is contained in the bond 10 at least by 50%, and the filler 11 having a small diameter on the corner of the electrode 5 is allowed to fall to the side of the electrode 5 by the ultrasonic vibration.

COPYRIGHT: (C)2004,JPO