| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless gold plating liquid which exhibits a sufficient deposition rate even at a low liquid temperature of about 60 to 80°C, enables a satisfactory film appearance, and particularly has excellent stability. SOLUTION: The electroless gold plating liquid comprises a gold salt, a phenyl compound-based reducing agent, a heavy metal salt and a sulfur based compound. COPYRIGHT: (C)2004,JPO
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