| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor device that does not comprise a halogen flame retardant and an antimony compound, and that has properties excellent in flame retardancy, molding behavior such as flowability and curability, soldering resistance and high-temperature storing characteristics. SOLUTION: This epoxy resin composition for encapsulating a semiconductor device comprises, as indispensable ingredients, (A) a biphenyl epoxy resin, (B) a phenol aralkyl resin, (C) a triazine-modified phenol novolak resin, (D) a curing accelerator and (E) an inorganic filler. COPYRIGHT: (C)2004,JPO
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