| 发明名称 |
MODULAR BOARD DEVICE AND HIGH FREQUENCY MODULE AND METHOD FOR PRODUCING THEM |
| 摘要 |
A high frequency module employed in a radio communication module, comprising a first organic board (11) having a conductor pattern formed on the major surface and mounting one or more element body (7) thereon, and a second organic board (12) having a recess (2) corresponding to the mounting region of the element body (7) in the surface thereof bonded to the first organic board (11). Under a state where the second organic board (12) is bonded to the first organic board (11), the recess (22) defines an element body storing space section (24) for sealing the element body (7) while sustaining moisture resistant characteristics and oxidation resistant characteristics. |
| 申请公布号 |
WO2004006332(A1) |
申请公布日期 |
2004.01.15 |
| 申请号 |
WO2003JP07827 |
申请日期 |
2003.06.19 |
| 申请人 |
SONY CORPORATION;OKUBORA, AKIHIKO |
发明人 |
OKUBORA, AKIHIKO |
| 分类号 |
H01L23/12;H01L21/60;H01L21/607;H01L23/00;H01L23/04;H01L23/10;H01L23/538;H01L23/552;H01L23/66;H01L25/00;H01L25/16;H01P1/12;H05K1/02;H05K1/18;H05K3/46 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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