| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive tape for glass substrate dicing, capable of obtaining cut out pieces excellent in shape property and hardly generating chipping or chip-scattering on the cut out pieces. <P>SOLUTION: This adhesive sheet for the glass substrate dicing is provided by installing the adhesive layer on a substrate film, wherein, the substrate film has≥130μm thickness and≥1 GPa tensile modulus, and the thickness of the adhesive layer is≤9μm. <P>COPYRIGHT: (C)2004,JPO</p> |
